Lionel Chien Hui Tay

This inventor holds 110 USPTO granted patents and 3 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L2924-01029). Top assignees: Stats Chippac Pte. Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd., Stats Chippac, Ltc.. Active years: 2009-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lionel Chien Hui Tay. Retrieved from https://idiyas.com/inventor/lionel-chien-hui-tay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 110 (Patent Applications = 3)

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 11

Forward Citations = 652(Granted Patents)

Forward Citations (Not Self Cited) = 606(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

108 out of 1,846

Stats Chippac Pte. Ltd.

patents

1 out of 15

Jcet Semiconductor (Shaoxing) Co., Ltd.

Years Active: 2009-2020

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Areas of Expertise:

Semiconductor Device

Wafer Level Package

Integrated Circuit

Optical Sensor

Conductive Bumps

Thermal Management

TSV Interconnects

Heat Spreader Frame

Interconnect Structure

Leadframe

Die Integration

External Interconnects

110 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10651139 - Semiconductor device and method of forming wafer level ground plane and power ring (2020-05-12),

2. RE47923 - Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps (2020-03-30),

3. 9922955 - Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP (2018-03-20),

4. 9666540 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2017-05-30),

5. 9589876 - Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection (2017-03-07),

6. 9525080 - Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device (2016-12-20),

7. 9397236 - Optical semiconductor device having pre-molded leadframe with window and method therefor (2016-07-19),

8. 9390991 - Semiconductor device and method of forming wafer level ground plane and power ring (2016-07-12),

9. 9337161 - Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof (2016-05-10),

10. 9257357 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2016-02-09),

11. 9252075 - Semiconductor device and method of forming a conductive via-in-via structure (2016-02-02),

12. 9202777 - Semiconductor package system with cut multiple lead pads (2015-12-01),

13. 9142531 - Integrated circuit packaging system with plated leads and method of manufacture thereof (2015-09-22),

14. 9142514 - Semiconductor device and method of forming wafer level die integration (2015-09-22),

15. 9129971 - Semiconductor device with bump interconnection (2015-09-08),

Title: Innovator Spotlight: Lionel Chien Hui Tay

Introduction:

Lionel Chien Hui Tay is a renowned inventor based in Singapore, SG, with an impressive portfolio of 110 patents. His groundbreaking work in the field of technology has established him as a leading figure in the industry, inspiring a new wave of innovators to push the boundaries of what is possible.

Latest Patents:

Among his latest patents is a semiconductor device and a method of forming a wafer-level ground plane and power ring. This innovation demonstrates Lionel's expertise in optimizing semiconductor die structures for enhanced performance and connectivity. Additionally, his work on forming a PiP semiconductor device with inner known good die showcases his commitment to advancing semiconductor packaging technologies.

Career Highlights:

Lionel Chien Hui Tay has made significant contributions to the field of technology through his roles at companies like Stats Chippac Pte. Ltd. and Stats Chippac, Ltd. His innovative solutions have paved the way for advancements in semiconductor manufacturing, solidifying his reputation as a pioneer in the industry.

Collaborations:

Throughout his career, Lionel has collaborated with esteemed colleagues such as Zigmund Ramirez Camacho and Henry Descalzo Bathan. These partnerships have fueled creativity and innovation, leading to the development of cutting-edge technologies that have shaped the landscape of the semiconductor industry.

Conclusion:

In conclusion, Lionel Chien Hui Tay's inventive spirit and dedication to driving change through his inventions have established him as a key player in the world of technology. His impressive patent portfolio and collaborative efforts have set a high standard for innovation, inspiring future generations of inventors to think innovatively and create a brighter future.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: