The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jul. 23, 2012
Applicants:

Zigmund R. Camacho, Singapore, SG;

Henry D. Bathan, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Arnel Senosa Trasporto, Singapore, SG;

Inventors:

Zigmund R. Camacho, Singapore, SG;

Henry D. Bathan, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Arnel Senosa Trasporto, Singapore, SG;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 21/683 (2006.01); H01L 27/146 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 21/6835 (2013.01); H01L 24/19 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 27/14618 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 24/05 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 27/14625 (2013.01); H01L 31/0232 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A semiconductor device includes a carrier and semiconductor die having an optically active region. The semiconductor die is mounted to the carrier to form a separation between the carrier and the semiconductor die. The semiconductor device further includes a passivation layer disposed over a surface of the semiconductor die and a glass layer disposed over a surface of the passivation layer. The passivation layer has a clear portion for passage of light to the optically active region of the semiconductor die. The semiconductor device further includes an encapsulant disposed over the carrier within the separation to form an expansion region around a periphery of the semiconductor die, a first via penetrating the expansion region, glass layer, and passivation layer, a second via penetrating the glass layer and passivation layer to expose a contact pad on the semiconductor die, and a conductive material filling the first and second vias.


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