Henry Descaizo Bathan

This inventor holds 53 USPTO granted patents, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Stats Chippac Pte. Ltd., St Assembly Test Services Inc.. Active years: 2004-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henry Descaizo Bathan. Retrieved from https://idiyas.com/inventor/henry-descaizo-bathan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 53

% Patents Active = 96.2

Average Co-Inventor Count = 3.8

ph-index = 12

Forward Citations = 560(Granted Patents)

Forward Citations (Not Self Cited) = 548(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

52 out of 1,843

Stats Chippac Pte. Ltd.

patents

1 out of 103

St Assembly Test Services Inc.

patents

Years Active: 2004-2017

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Areas of Expertise:

Integrated Circuit

Optical Sensor

Wafer-Level Package

Leadframe Design

Stacked Die

Non-Leaded Package

Bump Interconnection

Multi-Row Etched Leadframe

Vertical Interconnect

Bonding Pads

Semiconductor Device

Electrical Interconnect

53 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9721925 - Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure (2017-08-01),

2. 9589876 - Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection (2017-03-07),

3. 9525080 - Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device (2016-12-20),

4. 9472427 - Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die (2016-10-18),

5. 9397236 - Optical semiconductor device having pre-molded leadframe with window and method therefor (2016-07-19),

6. 9129971 - Semiconductor device with bump interconnection (2015-09-08),

7. 9006031 - Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps (2015-04-14),

8. 8993376 - Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die (2015-03-31),

9. 8921983 - Semiconductor package and method of forming similar structure for top and bottom bonding pads (2014-12-30),

10. 8872320 - Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure (2014-10-28),

11. 8866275 - Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect (2014-10-21),

12. 8866248 - Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device (2014-10-21),

13. 8802505 - Semiconductor device and method of forming a protective layer on a backside of the wafer (2014-08-12),

14. 8633578 - Integrated circuit package system with laminate base (2014-01-21),

15. 8633062 - Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof (2014-01-21),

Title: Henry Descaizo Bathan: Pioneering Inventor from Singapore

Introduction: Henry Descaizo Bathan is a renowned inventor hailing from Singapore, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bathan holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Bathan has worked tirelessly to develop cutting-edge solutions that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Bathan has collaborated with leading tech companies, research institutions, and universities, fostering a culture of innovation and knowledge sharing.

Conclusion: Henry Descaizo Bathan's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors to dream big and create change.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]