The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Mar. 22, 2011
Henry D. Bathan, Singapore, SG;
Zigmund R. Camacho, Singapore, SG;
Jairus L. Pisigan, Singapore, SG;
Henry D. Bathan, Singapore, SG;
Zigmund R. Camacho, Singapore, SG;
Jairus L. Pisigan, Singapore, SG;
STATS ChipPAC Pte. Ltd., Singapore, SG;
Abstract
A semiconductor device has a leadframe with first and second opposing surfaces and a plurality of notched fingers. The leadframe is mounted to a carrier. A first semiconductor die is mounted over the carrier between the notched fingers. Conductive TSVs are formed through the first semiconductor die. A bond wire is formed between a first contact pad on the first semiconductor die and notched finger. The conductive TSV are electrically connected to the bond wires. An encapsulant is deposited over the first semiconductor die and notched fingers. Bumps are formed over the first surface of the leadframe. The carrier is removed and the leadframe is singulated. The leadframe and first semiconductor die is mounted to a substrate. A second semiconductor die is mounted to a second contact pad on the first semiconductor die. A third semiconductor die is mounted to the second surface of the leadframe.