The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Jun. 24, 2010
Applicants:
Jeffrey D. Punzalan, Singapore, SG;
Henry Descaizo Bathan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Amel Trasporto, Singapore, SG;
Inventors:
Jeffrey D. Punzalan, Singapore, SG;
Henry Descaizo Bathan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Amel Trasporto, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.