Singapore, Singapore

Amel Trasporto

This inventor holds 2 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2013-2014.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2013-2014

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2 patents (USPTO):Explore Patents

Title: Amel Trasporto: Innovator in Semiconductor Technology

Introduction

Amel Trasporto is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. With a total of 2 patents, he has made significant advancements in integrated circuit packaging and optical semiconductor devices.

Latest Patents

His latest patents include an "Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof." This patent describes a method for manufacturing an integrated circuit package system that involves forming a paddle, an outer lead, and an inner lead, encapsulating an integrated circuit die over the paddle. Another significant patent is for an "Optical semiconductor device having pre-molded leadframe with window and method therefor." This invention details a semiconductor device that aligns a semiconductor die with a light transmitting material, ensuring optimal light transmission to the optically active area.

Career Highlights

Amel Trasporto is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has contributed to the development of advanced packaging solutions that enhance the performance and efficiency of semiconductor devices.

Collaborations

He has collaborated with talented coworkers such as Henry Descaizo Bathan and Zigmund Ramirez Camacho, further enriching the innovative environment at Stats Chippac Pte. Ltd.

Conclusion

Amel Trasporto's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence advancements in integrated circuit packaging and optical devices.

Profile summary based on public USPTO records.
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