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For the Inventor, By the Inventor

Singapore, Singapore

Arnel Senosa Trasporto

USPTO Granted Patents = 83 

Average Co-Inventor Count = 3.5

ph-index = 9

Forward Citations = 443(Granted Patents)

Forward Citations (Not Self Cited) = 432(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal82 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal1 out of 103 
 
St Assembly Test Services Inc.
 patents

Years Active: 2002-2020

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Packaging
Optical Sensor
Leadframe System
Conductive Bumps
Thermal Structures
Coreless Packaging
Routable Traces
Embedded Sensor Die
Grid Array Mechanism
Interconnect Structure
Paddle Interlock
83 patents (USPTO):Explore Patents
1. RE47923 - Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps (2020-03-30),
2. 10068862 - Semiconductor device and method of forming a package in-fan out package (2018-09-04),
3. 9799589 - Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof (2017-10-24),
4. 9620480 - Integrated circuit packaging system with unplated leadframe and method of manufacture thereof (2017-04-11),
5. 9576873 - Integrated circuit packaging system with routable trace and method of manufacture thereof (2017-02-21),
6. 9525080 - Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device (2016-12-20),
7. 9449932 - Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die (2016-09-20),
8. 9397236 - Optical semiconductor device having pre-molded leadframe with window and method therefor (2016-07-19),
9. 9368423 - Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package (2016-06-14),
10. 9324641 - Integrated circuit packaging system with external interconnect and method of manufacture thereof (2016-04-26),
11. 9324584 - Integrated circuit packaging system with transferable trace lead frame (2016-04-26),
12. 9312194 - Integrated circuit packaging system with terminals and method of manufacture thereof (2016-04-12),
13. 9305873 - Integrated circuit packaging system with electrical interface and method of manufacture thereof (2016-04-05),
14. 9299644 - Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof (2016-03-29),
15. 9293351 - Integrated circuit packaging system with planarity control and method of manufacture thereof (2016-03-22),

Title: The Innovative Journey of Arnel Senosa Trasporto

Introduction:

Arnel Senosa Trasporto is a visionary inventor hailing from Singapore, SG. With a passion for pushing the boundaries of technology, he has made significant contributions to the field of innovation.

Latest Patents:

Arnel Senosa Trasporto's latest patents showcase his dedication to creating cutting-edge solutions in various industries. His recent inventions have been recognized for their creativity and practicality.

Career Highlights:

Throughout his illustrious career, Arnel Senosa Trasporto has demonstrated a remarkable ability to transform ideas into tangible inventions. His innovative spirit has led to the development of groundbreaking technologies that have revolutionized the way we live and work.

Collaborations:

Arnel Senosa Trasporto has collaborated with leading experts and organizations in the industry to bring his inventions to life. His partnerships have been instrumental in driving forward his vision and achieving success in the competitive world of innovation.

Conclusion:

In conclusion, Arnel Senosa Trasporto stands as a beacon of creativity and ingenuity in the world of inventors. His relentless pursuit of innovation continues to inspire others to think outside the box and create a better future for all.

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