The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Dec. 14, 2012
Byung Tai DO, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei EE Chua, Singapore, SG;
Byung Tai Do, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei Ee Chua, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
System and method of manufacturing an integrated circuit packaging system using transferable trace lead frame. A lead frame is provided having lower metal contacts. A masking layer can be formed on an upper surface of the lead frame for protection and shielding purposes. Routing layer and conductive lands may subsequently be formed by shaping the lead frame, along with bottom encapsulation. The masking layer may subsequently be removed for additional processing steps including connecting an integrated circuit die to the upper surface of the lead frame.