The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Mar. 20, 2012
Byung Tai DO, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei EE Chua, Singapore, SG;
Byung Tai Do, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei Ee Chua, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting platform; applying an attach layer on the mounting platform; mounting an integrated circuit die on the attach layer; forming an encapsulation on the integrated circuit die and the attach layer, the mounting platform exposed from the encapsulation; and forming a terminal having a terminal protrusion from the leadframe, the terminal protrusion below a horizontal plane of the mounting platform.