The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
May. 30, 2008
Lionel Chien Hui Tay, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A semiconductor package system includes: providing a leadframe having inner frame bars, outer frame bars, a die pad, tiebars, and rows of leads, the inner frame bars being coplanar with outer frame bars; attaching a semiconductor chip to the die pad; attaching bond wires between the semiconductor chip and the rows of leads; encapsulating the semiconductor chip, the bond wires, the inner frame bars, the outer frame bars, the die pad, the tiebars, and the rows of leads in an encapsulant; cutting a groove to remove the inner frame bars; and singulating the leadframe and the encapsulant to remove the outer frame bars.