Abelardo Jr Hadap Advincula

This inventor holds 8 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Abelardo Jr Hadap Advincula. Retrieved from https://idiyas.com/inventor/abelardo-jr-hadap-advincula

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 11(Granted Patents)

Company Filing History:

8 out of 1,845

Stats Chippac Pte. Ltd.

patents

Years Active: 2010-2015

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9059074 - Integrated circuit package system with planar interconnect (2015-06-16),

2. 8957515 - Integrated circuit package system with array of external interconnects (2015-02-17),

3. 8258614 - Integrated circuit package system with package integration (2012-09-04),

4. 8129827 - Integrated circuit package system with package encapsulation having recess (2012-03-06),

5. 8115287 - Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof (2012-02-14),

6. 8067825 - Integrated circuit package system with multiple die (2011-11-29),

7. 7919848 - Integrated circuit package system with multiple devices (2011-04-05),

8. 7785929 - Mountable integrated circuit package system with exposed external interconnects (2010-08-31),

Title: Innovations of Abelardo Jr Hadap Advincula

Introduction

Abelardo Jr Hadap Advincula is a notable inventor based in Singapore, known for his contributions to integrated circuit technology. He holds a total of 8 patents, showcasing his expertise and innovative spirit in the field of electronics.

Latest Patents

Among his latest patents is the "Integrated circuit package system with planar interconnect." This invention involves a method of mounting an integrated circuit die adjacent to a lead, forming a first encapsulation around the die and lead, and creating a planar interconnect on the first encapsulation. Another significant patent is the "Integrated circuit package system with array of external interconnects." This system includes forming an array of external interconnects, removing an intersecting region to create an isolation hole, and encapsulating the integrated circuit die while partially exposing the external interconnects.

Career Highlights

Abelardo Jr Hadap Advincula is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in integrated circuit packaging. His work has significantly impacted the efficiency and functionality of electronic devices.

Collaborations

He has collaborated with talented coworkers such as Zigmund Ramirez Camacho and Lionel Chien Hui Tay, contributing to various projects that enhance the capabilities of integrated circuits.

Conclusion

Abelardo Jr Hadap Advincula's contributions to the field of integrated circuits demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a drive to improve electronic systems.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]