Singapore, Singapore

Abelardo Jr Hadap Advincula


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2010-2015

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8 patents (USPTO):Explore Patents

Title: Innovations of Abelardo Jr Hadap Advincula

Introduction

Abelardo Jr Hadap Advincula is a notable inventor based in Singapore, known for his contributions to integrated circuit technology. He holds a total of 8 patents, showcasing his expertise and innovative spirit in the field of electronics.

Latest Patents

Among his latest patents is the "Integrated circuit package system with planar interconnect." This invention involves a method of mounting an integrated circuit die adjacent to a lead, forming a first encapsulation around the die and lead, and creating a planar interconnect on the first encapsulation. Another significant patent is the "Integrated circuit package system with array of external interconnects." This system includes forming an array of external interconnects, removing an intersecting region to create an isolation hole, and encapsulating the integrated circuit die while partially exposing the external interconnects.

Career Highlights

Abelardo Jr Hadap Advincula is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in integrated circuit packaging. His work has significantly impacted the efficiency and functionality of electronic devices.

Collaborations

He has collaborated with talented coworkers such as Zigmund Ramirez Camacho and Lionel Chien Hui Tay, contributing to various projects that enhance the capabilities of integrated circuits.

Conclusion

Abelardo Jr Hadap Advincula's contributions to the field of integrated circuits demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a drive to improve electronic systems.

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