The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Sep. 13, 2007
Applicants:
Zigmund Ramirez Camacho, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Abelardo Jr Hadap Advincula, Singapore, SG;
Inventors:
Zigmund Ramirez Camacho, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Abelardo Jr Hadap Advincula, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.