The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Aug. 03, 2007
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Abelardo Jr Hadap Advincula, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Abelardo Jr Hadap Advincula, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile