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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8941219 B1

PDFFull Text
Date of Patent:
Jan. 27, 2015

Filed:

Apr. 05, 2011

Etched recess package on package system

Applicants:

Zigmund Ramirez Camacho, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Jairus Legaspi Pisigan, Singapore, SG;

Inventors:

Zigmund Ramirez Camacho, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Jairus Legaspi Pisigan, Singapore, SG;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:

Ishimaru & Associates LLP

Primary Examiner:

Zandra Smith

Assistant Examiner:

Khanh Duong

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49551 (2013.01); H01L 21/4828 (2013.01); H01L 23/3107 (2013.01); H01L 23/495 (2013.01); H01L 24/49 (2013.01); H01L 25/105 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); H01L 24/48 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/014 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1029 (2013.01); H01L 2225/1058 (2013.01);
Abstract

An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.

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