The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 28, 2013
Applicants:

Byung Tai DO, Singapore, SG;

Arnel Senosa Trasporto, Singapore, SG;

Linda Pei EE Chua, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Inventors:

Byung Tai Do, Singapore, SG;

Arnel Senosa Trasporto, Singapore, SG;

Linda Pei Ee Chua, Singapore, SG;

Henry Descalzo Bathan, Singapore, SG;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 21/4825 (2013.01);
Abstract

An integrated circuit packaging system and method of manufacture thereof including: providing a pre-plated leadframe having a contact protrusion and a protective pad on the contact protrusion; forming a contact pad and traces by etching the pre-plated leadframe; applying a trace protection layer on the contact pad, the traces, and the protective pad; removing the protective pad and a portion of the trace protection layer for exposing the contact pad; and depositing an external connector directly on a surface of the contact pad.


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