The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Oct. 28, 2011
Emmanuel Espiritu, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the power bar terminal; depositing a contact pad on one of the signal contacts; coupling an integrated circuit die to the power bar terminal and the signal contacts; and forming a package body on the integrated circuit die.