Stats Chippac Pte. Ltd.

Stat Chippac Ltd.

Henry Descalzo Bathan

Zigmund Ramirez Camacho

Lionel Chien Hui Tay

Emmanuel Espiritu

Jairus Legaspi Pisigan

Arnel Senosa Trasporto

Jeffrey David Punzalan

Dioscoro A Merilo

Jose Alvin Caparas

Abelardo Jr Hadap Advincula

Byung Tai Do

Frederick Rodriguez Dahilig

Guruprasad Badakere Govindaiah

Il Kwon Shim

Abelardo Hadap Advincula, Jr

Linda Pei Ee Chua

Philip Lyndon Cablao

Reza A Pagaila

Byung Joon Han

Flynn P Carson

Rachel Layda Abinan

Allan Pumatong Ilagan

Albelardo Jr Hadap Advincula

Elizar Andres

Frederick Rodriguez Gahilig

A PiP semiconductor device has an inner known good semiconductor package. In the semiconductor package, a first via is formed in a temporary carrier. A first conductive layer is formed over the carrier and into the first via. The first conductive layer in the first via forms a conductive bump. A first semiconductor die is mounted to the first conductive layer. A first encapsulant is deposited over the first die and carrier. The semiconductor package is mounted to a substrate. A second semiconductor die is mounted to the first conductive layer opposite the first die. A second encapsulant is deposited over the second die and semiconductor package. A second via is formed in the second encapsulant to expose the conductive bump. A second conductive layer is formed over the second encapsulant and into the second via. The second conductive layer is electrically connected to the second die.

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

An integrated circuit packaging system and method of manufacture thereof including: providing a pre-plated leadframe having a contact protrusion and a protective pad on the contact protrusion; forming a contact pad and traces by etching the pre-plated leadframe; applying a trace protection layer on the contact pad, the traces, and the protective pad; removing the protective pad and a portion of the trace protection layer for exposing the contact pad; and depositing an external connector directly on a surface of the contact pad.

Integrated circuit packaging system with trace protection layer and method of manufacture thereof

An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.

Integrated circuit packaging system with plated leads and method of manufacture thereof

An integrated circuit package system includes: mounting an integrated circuit die adjacent to a lead; forming a first encapsulation around and exposing the integrated circuit die and the lead; and forming a planar interconnect between the integrated circuit die and the lead with the planar interconnect on the first encapsulation.

Integrated circuit package system with planar interconnect

A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an encapsulant over the integrated circuit, over the upper structure, and in the opening with the base side exposed; removing the tie bars exposing a first surface and a second surface of the encapsulant below the first surface, and forming a die paddle from the upper structure and exposed from the second surface; and removing the leadframe from the base side forming island terminals from the upper protrusions exposed from the second surface and isolated from the die paddle.

Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.

Integrated circuit packaging system with a flip chip and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead, the lead conductive cap includes a nickel layer having a thickness between 2.55 &#x3bc;m to 8.00 &#x3bc;m deposited on the lead, a palladium layer deposited on the nickel layer, and a gold layer deposited on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.

Integrated circuit packaging system with a lead and method of manufacture thereof

An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a barrier under the bottom of the die pad; mounting an integrated circuit die on the top of the die pad; encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad; and mounting an external interconnect on the center pad.

Integrated circuit package system with relief

An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed.

Integrated circuit package system with array of external interconnects

An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.

Etched recess package on package system

An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation.

Integrated circuit package system with device cavity

A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.

Integrated circuit packaging system with die paddles and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the power bar terminal; depositing a contact pad on one of the signal contacts; coupling an integrated circuit die to the power bar terminal and the signal contacts; and forming a package body on the integrated circuit die.

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Singapore, Singapore

Henry Descalzo Bathan