The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Mar. 10, 2006
Applicants:
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
Inventors:
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.