The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2013

Filed:

Jul. 01, 2008
Applicants:

Henry Descalzo Bathan, Singapore, SG;

IL Kwon Shim, Singapore, SG;

Zigmund Ramirez Camacho, Singapore, SG;

Philip Lyndon Cablao, Singapore, SG;

Jose Alvin Caparas, Singapore, SG;

Inventors:

Henry Descalzo Bathan, Singapore, SG;

Il Kwon Shim, Singapore, SG;

Zigmund Ramirez Camacho, Singapore, SG;

Philip Lyndon Cablao, Singapore, SG;

Jose Alvin Caparas, Singapore, SG;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.


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