Company Filing History:

41 out of 1,812

Stats Chippac Pte. Ltd.

patents

5 out of 103

St Assembly Test Services Inc.

patents

2 out of 15

Jcet Semiconductor (shaoxing) Co., Ltd.

patents

Years Active: 2006-2021

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48 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11127668 - Semiconductor device and method of forming double-sided fan-out wafer level package (2021-09-21),

2. 10622293 - Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) (2020-04-14),

3. 10453785 - Semiconductor device and method of forming double-sided fan-out wafer level package (2019-10-22),

4. 10446523 - Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP (2019-10-15),

5. 10297556 - Semiconductor device and method of controlling warpage in reconstituted wafer (2019-05-21),

6. 10163747 - Semiconductor device and method of controlling warpage in reconstituted wafer (2018-12-25),

7. 9607965 - Semiconductor device and method of controlling warpage in reconstituted wafer (2017-03-28),

8. 9443797 - Semiconductor device having wire studs as vertical interconnect in FO-WLP (2016-09-13),

9. 9293401 - Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) (2016-03-22),

10. 9281259 - Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP (2016-03-08),

11. 9153544 - Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die (2015-10-06),

12. 9142428 - Semiconductor device and method of forming FO-WLCSP with multiple encapsulants (2015-09-22),

13. 9076737 - Integrated circuit packaging system with bumps and method of manufacture thereof (2015-07-07),

14. 9059157 - Integrated circuit packaging system with substrate and method of manufacture thereof (2015-06-16),

15. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),

Title: Jose Alvin Caparas: Pioneering Inventor from Singapore

Introduction: Jose Alvin Caparas is a distinguished inventor hailing from the vibrant city-state of Singapore. With a passion for innovation and a keen eye for problem-solving, Caparas has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: Caparas holds several patents in the areas of artificial intelligence, renewable energy, and sustainable urban development. His most recent patent involves a cutting-edge AI algorithm designed to optimize energy consumption in smart cities.

Career Highlights: Throughout his illustrious career, Caparas has worked with leading tech companies and research institutions to bring his innovative ideas to life. He has been recognized for his exceptional creativity and technical expertise, earning him a reputation as a trailblazer in the industry.

Collaborations: Caparas has collaborated with top engineers, scientists, and designers on various projects, fostering a culture of innovation and collaboration. His ability to work across disciplines and bring diverse perspectives to the table has been instrumental in the success of his inventions.

Conclusion: Jose Alvin Caparas continues to push the boundaries of technology and inspire the next generation of inventors with his groundbreaking work. His dedication to creating a more sustainable and efficient world through innovation serves as a testament to his visionary spirit and unwavering commitment to excellence.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.