The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2015

Filed:

Jun. 19, 2009
Applicants:

Zigmund Ramirez Camacho, Singapore, SG;

Emmanuel Espiritu, Singapore, SG;

Jose Alvin Caparas, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Inventors:

Zigmund Ramirez Camacho, Singapore, SG;

Emmanuel Espiritu, Singapore, SG;

Jose Alvin Caparas, Singapore, SG;

Lionel Chien Hui Tay, Singapore, SG;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/568 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.


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