The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Mar. 15, 2013
Yaojian Lin, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Junmo Koo, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
Yaojian Lin, Singapore, SG;
Il Kwon Shim, Singapore, SG;
JunMo Koo, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a top insulation layer and a top conductive layer; an inter-react layer on the substrate; an integrated circuit die on the substrate; a package body on the inter-react layer and the integrated circuit die; and a top solder bump on the top conductive layer, the top solder bump in a 3D via formed through the package body, the inter-react layer, and the top insulation layer for exposing the top conductive layer in the 3D via.