The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Aug. 04, 2006
Applicants:
Leo A. Merilo, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Inventors:
Leo A. Merilo, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.