The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Sep. 24, 2008
IL Kwon Shim, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Sebastian T. M. Soon, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Sebastian T. M. Soon, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.