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Hong Kong, China

Tsz Yin Ho

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 126(Granted Patents)

Location History:

Singapore, SG (2005 - 2009)
Hong Kong, CN (2007 - 2013)

Company Filing History:

10 out of 1,812

Stats Chippac Pte. Ltd.

Years Active: 2005-2013

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8513542 - Integrated circuit leaded stacked package system (2013-08-20),

2. 8164172 - Integrated circuit package in package system (2012-04-24),

3. 7986043 - Integrated circuit package on package system (2011-07-26),

4. 7981702 - Integrated circuit package in package system (2011-07-19),

5. 7928564 - Multichip module package and fabrication method (2011-04-19),

6. 7622325 - Integrated circuit package system including high-density small footprint system-in-package (2009-11-24),

7. 7619314 - Integrated circuit package system including die stacking (2009-11-17),

8. 7445955 - Multichip module package and fabrication method (2008-11-04),

9. 7298038 - Integrated circuit package system including die stacking (2007-11-20),

10. 6943057 - Multichip module package and fabrication method (2005-09-13),

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