The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Mar. 08, 2006
Applicants:
Heap Hoe Kuan, Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Singapore, SG;
Inventors:
Heap Hoe Kuan, Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit leaded stacked package system includes forming a no-lead integrated circuit package having a mold cap, and attaching a mold cap of an extended-lead integrated circuit package facing the mold cap of the no-lead integrated circuit package.