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For the Inventor, By the Inventor

Singapore, Singapore

Dioscoro A Merilo

USPTO Granted Patents = 62 

Average Co-Inventor Count = 3.6

ph-index = 13

Forward Citations = 646(Granted Patents)


Inventors with similar research interests:


Location History:

  • Talisay, PH (2017)
  • Singapore, SG (2003 - 2018)

Company Filing History:

goldMedal60 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal2 out of 103 
 
St Assembly Test Services Inc.
 patents

Years Active: 2003-2018

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62 patents (USPTO):Explore Patents
1. 9922955 - Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP (2018-03-20),
2. 9666540 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2017-05-30),
3. 9589910 - Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die (2017-03-07),
4. 9589876 - Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection (2017-03-07),
5. 9406619 - Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die (2016-08-02),
6. 9337161 - Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof (2016-05-10),
7. 9293385 - RDL patterning with package on package system (2016-03-22),
8. 9257357 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2016-02-09),
9. 9236352 - Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die (2016-01-12),
10. 9142514 - Semiconductor device and method of forming wafer level die integration (2015-09-22),
11. 9064876 - Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP (2015-06-23),
12. 8993376 - Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die (2015-03-31),
13. 8890328 - Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers (2014-11-18),
14. 8866275 - Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect (2014-10-21),
15. 8810017 - Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof (2014-08-19),

Title: Dioscoro A Merilo: Pioneer in Semiconductor Innovations

Introduction

Dioscoro A Merilo is a renowned inventor based in Singapore, recognized for his remarkable contributions to the field of semiconductor technology. With an impressive portfolio of 62 patents, he has not only advanced innovations in this sector but has also set benchmarks for future developments in semiconductor devices.

Latest Patents

Among his latest patents, one notable invention is the "Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP." This invention details a sophisticated semiconductor wafer that hosts multiple semiconductor dice. By employing first and second conductive layers on opposing surfaces, Merilo has enhanced the electrical connections through a Through-Silicon Via (TSV), facilitating efficient integration of multiple semiconductor components.

Another significant patent is the "Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die." This innovation involves the creation of a semiconductor device using a prefabricated heat spreader frame, which optimizes thermal management. The method includes depositing an encapsulant around vertical bodies and the semiconductor die, ensuring that contact pads remain accessible for interconnect processing.

Career Highlights

Dioscoro A Merilo has had a successful career working with prominent companies in the semiconductor industry. Notable among them are Stats Chippac Pte. Ltd. and St Assembly Test Services Inc. His extensive experience in these organizations has allowed him to develop advanced techniques and processes in semiconductor manufacturing.

Collaborations

Throughout his career, Merilo has collaborated with talented individuals in the industry, including Zigmund Ramirez Camacho and Seng Guan Chow. These partnerships have fostered an environment of innovation and creativity, leading to groundbreaking advancements in the technological landscape.

Conclusion

Dioscoro A Merilo's extensive contributions to semiconductor technology through his numerous patents highlight his status as a leading innovator in the field. His work not only pushes the boundaries of what is possible in semiconductor design but also inspires future generations of inventors and engineers to continue exploring new horizons in this essential industry.

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