The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2009

Filed:

Oct. 09, 2007
Applicants:

Dario S. Filoteo, Jr., Singapore, SG;

Tsz Yin Ho, Tuen Mun, HK;

Inventors:

Dario S. Filoteo, Jr., Singapore, SG;

Tsz Yin Ho, Tuen Mun, HK;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die over the integrated circuit package with the die located within the aperture.


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