The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Jun. 22, 2011
Tsz Yin Ho, Tuen Mun, HK;
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaanor, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaanor, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface; a package-stacking layer over the base integrated circuit package; and the extended-lead integrated circuit package over the base integrated circuit package including: an end portion of the extended lead, directly on the package-stacking layer, and the extended lead exposed by and extending away from the bottom of the side of an extended-lead encapsulation and bending downwards toward the direction of the package stacking layer with the substantially planar lead-end surface coplanar with the substantially planar base surface.