The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Mar. 08, 2006
Applicants:
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Inventors:
Dioscoro A. Merilo, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Tsz Yin Ho, Tuen Mun, HK;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.