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For the Inventor, By the Inventor

Singapore, Singapore

Antonio Bambalan Dimaano, Jr

This inventor holds 32 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignees: Stats Chippac Pte. Ltd., Utac Headquarters Pte. Ltd., St Assembly Test Services Inc.. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Antonio Bambalan Dimaano, Jr. Retrieved from https://idiyas.com/inventor/antonio-bambalan-dimaano-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32

% Patents Active = 90.6

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 145(Granted Patents)


Company Filing History:

goldMedal25 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal5 out of 79 
 
Utac Headquarters Pte. Ltd.
 patents
bronzeMedal1 out of 103 
 
St Assembly Test Services Inc.
 patents
4. 1 out of 48 
 
United Test and Assembly Center Limited
 patents

Years Active: 2003-2020

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Areas of Expertise:
Integrated Circuit Package
Heat Spreader
Multi-Layer Packaging
EMI Shielding
Device Stacking
Thermal Relief
Quad Flat Pack
Warp-Free Chip
Manufacturing Method
Interconnect Interface
Stackable System
Wire Sweep Resistance
32 patents (USPTO):Explore Patents
1. 10714431 - Semiconductor packages with electromagnetic interference shielding (2020-07-14),
2. 10658277 - Semiconductor package with a heat spreader and method of manufacturing thereof (2020-05-19),
3. 10573590 - Multi-layer leadless semiconductor package and method of manufacturing the same (2020-02-25),
4. 9564387 - Semiconductor package having routing traces therein (2017-02-07),
5. 9472532 - Leadframe area array packaging technology (2016-10-18),
6. 9023690 - Leadframe area array packaging technology (2015-05-05),
7. 8536689 - Integrated circuit package system with multi-surface die attach pad (2013-09-17),
8. 8422243 - Integrated circuit package system employing a support structure with a recess (2013-04-16),
9. 8421197 - Integrated circuit package system with warp-free chip (2013-04-16),
10. 8274145 - Semiconductor package system with patterned mask over thermal relief (2012-09-25),
11. 8232658 - Stackable integrated circuit package system with multiple interconnect interface (2012-07-31),
12. 8178394 - Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof (2012-05-15),
13. 8174127 - Integrated circuit package system employing device stacking (2012-05-08),
14. 8120187 - Integrated circuit package system employing device stacking and method of manufacture thereof (2012-02-21),
15. 8106500 - Stackable integrated circuit package system (2012-01-31),

Title: Antonio Bambalan Dimaano, Jr: Pioneering Inventor from Singapore

Introduction: Antonio Bambalan Dimaano, Jr is a renowned inventor hailing from Singapore, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Antonio Bambalan Dimaano, Jr holds several patents in the areas of artificial intelligence, renewable energy, and sustainable urban development, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With over two decades of experience in the industry, Antonio Bambalan Dimaano, Jr has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various sectors.

Collaborations: Throughout his career, Antonio Bambalan Dimaano, Jr has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: Antonio Bambalan Dimaano, Jr's passion for pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and entrepreneurs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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