The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Mar. 03, 2011
Frederick Rodriguez Dahilig, Singapore, SG;
Sheila Marie L. Alvarez, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Frederick Rodriguez Dahilig, Singapore, SG;
Sheila Marie L. Alvarez, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacturing an integrated circuit packaging system includes: providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour; forming a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa; mounting a first device adjacent to the inner lead; connecting a second device to the mesa; and forming an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device.