Enter inventor name

Frederick Rodriguez Dahilig

This inventor holds 19 USPTO granted patents and 3 published patent applications. Top assignees: Stats Chippac Pte. Ltd., Chippac, Inc.. Active years: 2010-2020.

USPTO Granted Patents = 19 (Patent Applications = 3)

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 89(Granted Patents)

Company Filing History:

18 out of 1,842

Stats Chippac Pte. Ltd.

Years Active: 2010-2020

Loading Chart...

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. RE47923 - Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps (2020-03-30),

2. 9666540 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2017-05-30),

3. 9257357 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2016-02-09),

4. 9142514 - Semiconductor device and method of forming wafer level die integration (2015-09-22),

5. 8937393 - Integrated circuit package system with device cavity (2015-01-20),

6. 8890328 - Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers (2014-11-18),

7. 8884418 - Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps (2014-11-11),

8. 8810015 - Integrated circuit packaging system with high lead count and method of manufacture thereof (2014-08-19),

9. 8518749 - Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die (2013-08-27),

10. 8405230 - Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof (2013-03-26),

11. 8344495 - Integrated circuit packaging system with interconnect and method of manufacture thereof (2013-01-01),

12. 8283209 - Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps (2012-10-09),

13. 8241954 - Wafer level die integration and method (2012-08-14),

14. 8174127 - Integrated circuit package system employing device stacking (2012-05-08),

15. 8120187 - Integrated circuit package system employing device stacking and method of manufacture thereof (2012-02-21),

Title: The Innovative Journey of Frederick Rodriguez Dahilig

Introduction: Frederick Rodriguez Dahilig is a pioneering inventor based in Singapore, SG, known for his groundbreaking contributions to various fields through his inventive spirit and dedication to innovation.

Latest Patents: Frederick Rodriguez Dahilig's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his versatility and forward-thinking approach to problem-solving.

Career Highlights: With a career spanning over two decades, Frederick Rodriguez Dahilig has established himself as a prominent figure in the innovation landscape, with numerous successful inventions that have had a significant impact on industries worldwide.

Collaborations: Throughout his career, Frederick Rodriguez Dahilig has collaborated with leading research institutions, universities, and multinational companies to bring his inventions to life, fostering a culture of innovation and knowledge-sharing.

Conclusion: Frederick Rodriguez Dahilig's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]