The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Jan. 14, 2011
Applicants:
Jae Soo Lee, Icheon-si, KR;
Geun Sik Kim, Gilbert, AZ (US);
Sheila Marie L. Alvarez, Singapore, SG;
Robinson Quiazon, Singapore, SG;
Hin Hwa Goh, Singapore, SG;
Frederick Rodriguez Dahilig, Singapore, SG;
Inventors:
Jae Soo Lee, Icheon-si, KR;
Geun Sik Kim, Gilbert, AZ (US);
Sheila Marie L. Alvarez, Singapore, SG;
Robinson Quiazon, Singapore, SG;
Hin Hwa Goh, Singapore, SG;
Frederick Rodriguez Dahilig, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.