Hin Hwa Goh

This inventor holds 30 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Stats Chippac Pte. Ltd., Chippac, Inc.. Active years: 2007-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hin Hwa Goh. Retrieved from https://idiyas.com/inventor/hin-hwa-goh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 (Patent Applications = 7)

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 8

Forward Citations = 191(Granted Patents)

Company Filing History:

29 out of 1,845

Stats Chippac Pte. Ltd.

Years Active: 2007-2025

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Areas of Expertise:

Semiconductor Device

Hybrid Substrate

Warpage Control

TSV Interconnects

Integrated Circuit

Encapsulation

Flip Chip Package

Common Voltage Bus

Insulating Layer

Dummy Copper Pattern

FO-WLCSP

Etched Leadframe

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469791 - Semiconductor device and method of stacking hybrid substrates with embedded electric components (2025-11-11),

2. 12381141 - Semiconductor device and method of forming hybrid substrate with uniform thickness (2025-08-05),

3. 10790158 - Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern (2020-09-29),

4. 10297556 - Semiconductor device and method of controlling warpage in reconstituted wafer (2019-05-21),

5. 10177010 - Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern (2019-01-08),

6. 10163747 - Semiconductor device and method of controlling warpage in reconstituted wafer (2018-12-25),

7. 9666500 - Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief (2017-05-30),

8. 9607965 - Semiconductor device and method of controlling warpage in reconstituted wafer (2017-03-28),

9. 9449943 - Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern (2016-09-20),

10. 9236278 - Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof (2016-01-12),

11. 9142428 - Semiconductor device and method of forming FO-WLCSP with multiple encapsulants (2015-09-22),

12. 9087930 - Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief (2015-07-21),

13. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),

14. 8916416 - Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface (2014-12-23),

15. 8766426 - Integrated circuit packaging system with warpage control and method of manufacture thereof (2014-07-01),

Title: Inventor Hin Hwa Goh - Pioneering Innovations in Singapore

Introduction: Hin Hwa Goh is a visionary inventor hailing from Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hin Hwa Goh's latest patents focus on advancements in renewable energy technologies, sustainable materials, and artificial intelligence systems, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Hin Hwa Goh has established herself as a leading figure in the innovation landscape of Singapore. Her work has been recognized globally for its ingenuity and impact.

Collaborations: Throughout her career, Hin Hwa Goh has collaborated with various research institutions, universities, and tech companies to bring her inventions to life. Her collaborative spirit has led to the development of cutting-edge technologies that have revolutionized multiple industries.

Conclusion: Hin Hwa Goh's relentless pursuit of innovation and her dedication to creating solutions for a better tomorrow make her a true pioneer in the world of inventions. Her work continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: