The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Sep. 24, 2010
Hin Hwa Goh, Singapore, SG;
Xusheng Bao, Singapore, SG;
Yung Kuan Hsiao, Singapore, SG;
Kang Chen, Singapore, SG;
Rui Huang, Singapore, SG;
Hin Hwa Goh, Singapore, SG;
Xusheng Bao, Singapore, SG;
Yung Kuan Hsiao, Singapore, SG;
Kang Chen, Singapore, SG;
Rui Huang, Singapore, SG;
STATS ChipPac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit device having component connectors directly on the carrier; placing a restraint structure over the integrated circuit device for controlling warpage of the integrated circuit device during bonding of the component connectors to the carrier causing some of the component connectors to separate from the carrier; and bonding all of the component connectors to the carrier.