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Singapore, Singapore

Kang Chen

USPTO Granted Patents = 118 (Patent Applications = 2)

Average Co-Inventor Count = 3.6

ph-index = 19

Forward Citations = 1,388(Granted Patents)

Forward Citations (Not Self Cited) = 1,308(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Singapore, SH (2017)
Singapore, SG (2010 - 2023)

Company Filing History:

116 out of 1,812

Stats Chippac Pte. Ltd.

Jcet Semiconductor (shaoxing) Co., Ltd.

Years Active: 2010-2025

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Areas of Expertise:

Microelectromechanical Systems (Mems)

Fan-Out Package

Vertical Interconnect Structures

Embedded Wafer Level Ball Grid Array

Dual-Sided Interconnect Structures

Power/Ground Planes

Wafer-Level Interconnect Structures

Build-Up Interconnect Structures

Reconstituted Wafer Warpage Control

Integrated Passive Devices

Micro-Vias

Conductive Channels

118 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12319564 - Semiconductor device and method of forming microelectromechanical systems (MEMS) package (2025-06-03),

2. 11569136 - Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP (2023-01-31),

3. 11488838 - Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB (2022-11-01),

4. 11370655 - Semiconductor device and method of forming microelectromechanical systems (MEMS) package (2022-06-28),

5. 11127666 - Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure (2021-09-21),

6. 11024561 - Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units (2021-06-01),

7. 10790158 - Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern (2020-09-29),

8. 10741416 - Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB (2020-08-11),

9. 10707150 - Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units (2020-07-07),

10. 10662056 - Semiconductor device and method of forming microelectromechanical systems (MEMS) package (2020-05-26),

11. 10622293 - Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) (2020-04-14),

12. 10607946 - Semiconductor device and method of forming interconnect substrate for FO-WLCSP (2020-03-31),

13. 10475779 - Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP (2019-11-12),

14. 10446479 - Semiconductor device and method of forming a PoP device with embedded vertical interconnect units (2019-10-15),

15. 10304817 - Semiconductor device and method of forming build-up interconnect structures over a temporary substrate (2019-05-28),

Title: The Innovative Journey of Inventor Kang Chen from Singapore

Introduction: Kang Chen, a visionary inventor hailing from Singapore, SG, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Kang Chen's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Kang Chen has established himself as a leading figure in the innovation landscape, with numerous patents granted and groundbreaking inventions that have revolutionized various industries.

Collaborations: Throughout his career, Kang Chen has collaborated with top research institutions, universities, and multinational companies to further develop and commercialize his inventions, demonstrating his ability to work across different sectors and disciplines.

Conclusion: Kang Chen's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a prolific inventor not only in Singapore but on a global scale. His contributions continue to inspire future generations of inventors and shape the technological landscape for years to come.

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