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For the Inventor, By the Inventor

Singapore, Singapore

Yung Kuan Hsiao

This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignees: Stats Chippac Pte. Ltd., Jcet Semiconductor (Shaoxing) Co., Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yung Kuan Hsiao. Retrieved from https://idiyas.com/inventor/yung-kuan-hsiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 31(Granted Patents)


Company Filing History:

goldMedal8 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal3 out of 15 
 
Jcet Semiconductor (Shaoxing) Co., Ltd.
 patents

Years Active: 2013-2024

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11 patents (USPTO):Explore Patents
1. 12148677 - Semiconductor device and method of forming ultra high density embedded semiconductor die package (2024-11-19),
2. 11227809 - Semiconductor device and method of forming ultra high density embedded semiconductor die package (2022-01-18),
3. 10916482 - Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure (2021-02-09),
4. 9824923 - Semiconductor device and method of forming conductive pillar having an expanded base (2017-11-21),
5. 9627338 - Semiconductor device and method of forming ultra high density embedded semiconductor die package (2017-04-18),
6. 9236278 - Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof (2016-01-12),
7. 8766426 - Integrated circuit packaging system with warpage control and method of manufacture thereof (2014-07-01),
8. 8524577 - Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure (2013-09-03),
9. 8513098 - Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure (2013-08-20),
10. 8455991 - Integrated circuit packaging system with warpage control and method of manufacture thereof (2013-06-04),
11. 8421212 - Integrated circuit packaging system with active surface heat removal and method of manufacture thereof (2013-04-16),

Title: Yung Kuan Hsiao: Pioneering Inventor from Singapore

Introduction: Yung Kuan Hsiao is a distinguished inventor hailing from the vibrant city-state of Singapore. With a passion for innovation and a keen eye for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents: Yung Kuan Hsiao's latest patents include groundbreaking developments in the fields of renewable energy, sustainable technologies, and artificial intelligence. His innovative solutions have garnered attention on a global scale for their potential to revolutionize various industries.

Career Highlights: Throughout his illustrious career, Yung Kuan Hsiao has been recognized for his inventive spirit and entrepreneurial mindset. His journey as an inventor has been marked by a series of successful patent applications and collaborations with leading research institutions.

Collaborations: Yung Kuan Hsiao has collaborated with top universities, research institutions, and innovative companies to bring his ideas to life. His partnerships have been instrumental in turning his visionary concepts into tangible products that have the potential to shape the future of technology.

Conclusion: Yung Kuan Hsiao's dedication to innovation and his relentless pursuit of excellence have established him as a trailblazing inventor in Singapore and beyond. His remarkable achievements serve as an inspiration to aspiring inventors and underscore the importance of creativity in driving progress and change.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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