The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Sep. 24, 2010
Yung Kuan Hsiao, Singapore, SG;
Xusheng Bao, Singapore, SG;
Kang Chen, Singapore, SG;
Hin Hwa Goh, Singapore, SG;
Rui Huang, Singapore, SG;
Yung Kuan Hsiao, Singapore, SG;
Xusheng Bao, Singapore, SG;
Kang Chen, Singapore, SG;
Hin Hwa Goh, Singapore, SG;
Rui Huang, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit device having chip interconnects; applying an attachment layer directly on the integrated circuit device; attaching a device stiffener to the integrated circuit device with the attachment layer; attaching a chip carrier to the chip interconnects with the device stiffener attached to the integrated circuit device for controlling warpage of the integrated circuit device to prevent the warpage from causing some of the chip interconnects to separate from the chip carrier during attachment of the chip interconnects to the chip carrier; and applying an underfill between the chip carrier and the integrated circuit device for controlling connectivity of all the chip interconnects to the chip carrier.