For the Inventor, By the Inventor

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Fremont, CA, United States of America

Chippac, Inc.

USPTO Granted Patents = 75

% Expired Patents = 8.0

EPO Patents = 1

Trademarks = 1

Forward Citations = 2,067

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45 inventors (with patents filed for the assignee):

Marcos Karnezos (43 out of 59 patents)

Rajendra D Pendse (17 out of 145 patents)

Flynn P Carson (11 out of 45 patents)

4. Seung Wook Park (5 out of 371 patents)

5. Hun-Teak Lee (5 out of 5 patents)

6. Ki-Youn Jang (5 out of 5 patents)

7. Nazir Ahmad (4 out of 11 patents)

8. Hyeog Chan Kwon (4 out of 20 patents)

9. Jong-Kook Kim (4 out of 4 patents)

10. Chul-Sik Kim (4 out of 4 patents)

11. Taekeun Lee (4 out of 4 patents)

12. Kyung-Moon Kim (4 out of 7 patents)

13. Young-Do Kweon (3 out of 5 patents)

14. Jong Wook Ju (3 out of 18 patents)

15. Sang Ho Lee (3 out of 3 patents)

Core Competencies:

Semiconductor Multi-Package Module

Wire Bond Interconnection

Flip Chip Technology

Ball Grid Array

Chip Scale Package

Thermal Management

Adhesive Structure

Die Attach

Integrated Heatsink

Stacked-Dies

Leadframe Package

Bumping Shape

75 patents: Sort by Forward Citations

1. 8970049 - Multiple chip package module having inverted package stacked over die (2015-03-03),

2. 8623704 - Adhesive/spacer island structure for multiple die package (2014-01-07),

3. 8552551 - Adhesive/spacer island structure for stacking over wire bonded die (2013-10-08),

4. 8143100 - Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages (2012-03-27),

5. 8129263 - Wire bond interconnection and method of manufacture thereof (2012-03-06),

6. 8030756 - Plastic ball grid array package with integral heatsink (2011-10-04),

7. 8030134 - Stacked semiconductor package having adhesive/spacer structure and insulation (2011-10-04),

8. 7986047 - Wire bond interconnection (2011-07-26),

9. 7935572 - Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages (2011-05-03),

10. 7880313 - Semiconductor flip chip package having substantially non-collapsible spacer (2011-02-01),

11. 7829382 - Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package (2010-11-09),

12. 7749807 - Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies (2010-07-06),

13. 7745322 - Wire bond interconnection (2010-06-29),

14. 7732254 - Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages (2010-06-08),

15. 7692279 - Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package (2010-04-06),

ChipPAC, Inc. is a leading provider of semiconductor packaging and test services. With over 50 years of industry experience, the company offers innovative packaging solutions to enable advanced semiconductor technologies. ChipPAC's expertise includes flip chip, wafer-level packaging, advanced packaging, and system-in-package solutions. The company serves a diverse range of industries including automotive, consumer electronics, telecommunications, and more.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

75 Patents

#36 in Fremont, CA

#1,153 in California

#4,900 in US

#9,996 in the World

Fremont, CA, United States of America

Chippac, Inc.

Forward Citations = 2,067

45 inventors:

Marcos Karnezos (43 out of 59 patents)

Rajendra D Pendse (17 out of 145 patents)

Flynn P Carson (11 out of 45 patents)

4. Seung Wook Park (5 out of 371 patents)

5. Hun-Teak Lee (5 out of 5 patents)

Please report any incorrect information to [email protected]

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