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For the Inventor, By the Inventor

Icheon-si, South Korea

Jong Wook Ju

USPTO Granted Patents = 18 

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 57(Granted Patents)


Location History:

  • Bubaleub Icheon, KR (2008 - 2010)
  • Kyoungki-do, KR (2011)
  • Ichon-si, KR (2010 - 2012)
  • Kyongman, KR (2013)
  • Kyoungnam, KR (2007 - 2014)
  • Icheon-Si, KR (2009 - 2014)
  • Bubal-eub Icheon-Si, KR (2014 - 2015)

Company Filing History:

goldMedal15 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal3 out of 75 
 
Chippac, Inc.
 patents

Years Active: 2007-2015

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18 patents (USPTO):Explore Patents
1. 8956914 - Integrated circuit package system with overhang die (2015-02-17),
2. 8659175 - Integrated circuit package system with offset stack (2014-02-25),
3. 8632112 - Workpiece displacement system (2014-01-21),
4. 8623704 - Adhesive/spacer island structure for multiple die package (2014-01-07),
5. 8617924 - Stacked integrated circuit package-in-package system and method of manufacture thereof (2013-12-31),
6. 8569882 - Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof (2013-10-29),
7. 8552551 - Adhesive/spacer island structure for stacking over wire bonded die (2013-10-08),
8. 8415204 - Integrated circuit packaging system with heat spreader and method of manufacture thereof (2013-04-09),
9. 8217501 - Integrated circuit package system including honeycomb molding (2012-07-10),
10. 8143102 - Integrated circuit package system including die having relieved active region (2012-03-27),
11. 8067831 - Integrated circuit package system with planar interconnects (2011-11-29),
12. 8067275 - Integrated circuit package system with package integration (2011-11-29),
13. 7772683 - Stacked integrated circuit package-in-package system (2010-08-10),
14. 7763961 - Hybrid stacking package system (2010-07-27),
15. 7737539 - Integrated circuit package system including honeycomb molding (2010-06-15),

Title: The Innovative Contributions of Jong Wook Ju

Introduction

Jong Wook Ju is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 18 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents, Jong Wook Ju has developed an integrated circuit package system with an overhang die. This system includes a substrate with a solder mask and a support structure, which allows for the mounting of an integrated circuit device. Another notable patent is the integrated circuit package system with an offset stack. This innovation involves the mounting of two integrated circuit devices in an offset configuration, enhancing the connectivity and encapsulation of the components.

Career Highlights

Throughout his career, Jong Wook Ju has worked with notable companies such as Stats Chippac Pte. Ltd. and Chippac, Inc. His experience in these organizations has contributed to his expertise in integrated circuit technology and packaging solutions.

Collaborations

Jong Wook Ju has collaborated with talented individuals in the field, including Hyeog Chan Kwon and Taeg Ki Lim. These partnerships have fostered innovation and the development of advanced technologies in integrated circuit packaging.

Conclusion

Jong Wook Ju's contributions to the field of integrated circuit packaging are noteworthy. His innovative patents and collaborations have significantly impacted the technology landscape, showcasing his dedication to advancing electronic device efficiency.

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