The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Jan. 12, 2006
Hyeog Chan Kwon, Seoul, KR;
Hyun Joung Kim, Namyangju, KR;
Jae Chang Kim, Changwon, KR;
Taeg Ki Lim, Cheongju-si, KR;
Jong Wook Ju, Ichon-si, KR;
Hyeog Chan Kwon, Seoul, KR;
Hyun Joung Kim, Namyangju, KR;
Jae Chang Kim, Changwon, KR;
Taeg Ki Lim, Cheongju-si, KR;
Jong Wook Ju, Ichon-si, KR;
STATS Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.