Company Filing History:

16 out of 1,812

Stats Chippac Pte. Ltd.

Years Active: 2007-2014

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20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8623704 - Adhesive/spacer island structure for multiple die package (2014-01-07),

2. 8552551 - Adhesive/spacer island structure for stacking over wire bonded die (2013-10-08),

3. 8375576 - Method for manufacturing wafer scale heat slug system (2013-02-19),

4. 8217501 - Integrated circuit package system including honeycomb molding (2012-07-10),

5. 8102043 - Stacked integrated circuit and package system and method for manufacturing thereof (2012-01-24),

6. 8067831 - Integrated circuit package system with planar interconnects (2011-11-29),

7. 8049322 - Integrated circuit package-in-package system and method for making thereof (2011-11-01),

8. 8030134 - Stacked semiconductor package having adhesive/spacer structure and insulation (2011-10-04),

9. 7975377 - Wafer scale heat slug system (2011-07-12),

10. 7932593 - Multipackage module having stacked packages with asymmetrically arranged die and molding (2011-04-26),

11. 7884460 - Integrated circuit packaging system with carrier and method of manufacture thereof (2011-02-08),

12. 7875966 - Stacked integrated circuit and package system (2011-01-25),

13. 7755180 - Integrated circuit package-in-package system (2010-07-13),

14. 7737539 - Integrated circuit package system including honeycomb molding (2010-06-15),

15. 7652376 - Integrated circuit package system including stacked die (2010-01-26),

Title: Hyeog Chan Kwon: Innovator in Semiconductor Technology

Introduction

Hyeog Chan Kwon is a notable inventor located in Seoul, South Korea, with an impressive portfolio of 20 patents to his name. His contributions to the field of semiconductor technology have made a significant impact, particularly in the development of adhesive and spacer structures used in multiple-die chip packages.

Latest Patents

Among his latest inventions, Kwon has patented an "Adhesive/Spacer Island Structure for Multiple Die Package." This innovative design involves an adhesive/spacer structure that adheres first and second dies to one another at a specified separation within a multiple-die semiconductor chip package. The structure features a series of spaced-apart adhesive/spacer islands, ensuring the dies remain securely bonded while occupying approximately 1-50% of the bonding region.

In addition, Kwon's inventive prowess is showcased in another patent titled "Adhesive/Spacer Island Structure for Stacking Over Wire Bonded Die." This patent outlines a method of utilizing adhesive/spacer structures to bond a first device, like a die or package, to a second device in a stacked semiconductor assembly. The design provides flexibility in the orientation of the packages, enhancing the efficiency and functionality of semiconductor devices.

Career Highlights

Throughout his career, Hyeog Chan Kwon has worked with notable companies, including Stats Chippac Pte. Ltd. and Chippac, Inc. His involvement in these organizations has allowed him to refine his expertise in semiconductor technologies and collaborate on numerous innovative projects.

Collaborations

Kwon has had the pleasure of working alongside talented professionals, including Jong-Woo Ha and Jong Wook Ju. These collaborations have fostered a rewarding environment for creative problem-solving and technological advancement in their shared field.

Conclusion

Hyeog Chan Kwon exemplifies the spirit of innovation in the semiconductor industry. His substantial contributions, highlighted by his recent patents, underline the importance of adhesive and spacer structures in advancing chip packaging technology. With his continued work, Kwon is set to further influence the landscape of electronics and semiconductor solutions.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.