The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Sep. 11, 2006
Applicants:
Sang Ho Lee, Yeoju, KR;
Jong Wook Ju, Kyoungnam, KR;
Hyeog Chan Kwon, Seoul, KR;
Inventors:
Assignee:
CHIPPAC, Inc., Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesive/spacer structure (A,) is used to adhere first and second die () to one another at a chosen separation in a multiple-die semiconductor chip package (). The first and second die define a die bonding region () therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (A) securing the first and second die to one another at a chosen separation (). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.