The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2011

Filed:

Oct. 21, 2005
Applicants:

Tae Sung Jeong, Kyoungki-do, KR;

Hyeog Chan Kwon, Seoul, KR;

Youngcheol Kim, Kyoung-do, KR;

Inventors:

Tae Sung Jeong, Kyoungki-do, KR;

Hyeog Chan Kwon, Seoul, KR;

Youngcheol Kim, Kyoung-do, KR;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stacked integrated circuit and package system including attaching a first top integrated circuit over an upper surface of a top substrate, attaching a second top integrated circuit over a lower surface of the top substrate, forming top electrical connectors on the lower surface of the top substrate, and connecting a bottom package to the top electrical connectors.


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