The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Jun. 15, 2011
Applicant:
Hyeog Chan Kwon, Seoul, KR;
Inventor:
Hyeog Chan Kwon, Seoul, KR;
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 1/11 (2006.01); H05K 7/00 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer; dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit; attaching the integrated circuit to a substrate; attaching the heat slug to the integrated circuit; and encapsulating the integrated circuit.