The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
May. 20, 2005
Sang Ho Lee, Kyonggi-do, KR;
Jong Wook Ju, Kyongman, KR;
Hyeog Chan Kwon, Seoul, KR;
Marcos Karnezos, Palo Alto, CA (US);
Sang Ho Lee, Kyonggi-do, KR;
Jong Wook Ju, Kyongman, KR;
Hyeog Chan Kwon, Seoul, KR;
Marcos Karnezos, Palo Alto, CA (US);
CHIPPAC, Inc., Fremont, CA (US);
Abstract
Adhesive/spacer structures used to adhere a first device, such as a die, or a package, to a second device in a stacked semiconductor assembly, include a plurality of spaced-apart adhesive/spacer islands securing the first and the second devices to one another at a chosen separation. Either or both of the first and second devices can be a die; or, either or both of the devices can be a package. A package includes a die mounted onto and electrically interconnected to, a substrate, and where one package is stacked over either a lower die or a lower package, the upper package may be oriented either so that the die attach side of the upper package faces toward the lower die or lower package substrate or so that the die attach side of the upper package faces away from the lower die or lower package substrate.