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Company Filing History:
Years Active: 1986-2015
Title: The Innovative Journey of Marcos Karnezos
Introduction: Marcos Karnezos, based in Palo Alto, CA, is a prolific inventor known for his significant contributions to the semiconductor industry. With an impressive portfolio of 59 patents, he has played a vital role in advancing technology through innovative solutions.
Latest Patents: Among his latest patents, Marcos has developed groundbreaking semiconductor multi-package modules. One notable invention includes a semiconductor multi-package module featuring a tape substrate land grid array package stacked over a ball grid array package. This design employs a single metal layer tape substrate, which integrates a patterned metal layer affixed to a patterned dielectric layer. Such configurations are essential for effective interconnection between die and other module components. Another significant patent entails a multi-chip package module that includes an inverted package stacked over a die, incorporating design innovations that prevent damage during the stacking process.
Career Highlights: Throughout his career, Marcos Karnezos has worked with influential companies, including Chippac, Inc. and Stats Chippac Pte. Ltd. His diverse experiences in these organizations have refined his expertise and propelled his innovative spirit in the realm of semiconductor technology.
Collaborations: Marcos has collaborated with notable professionals, including Flynn P. Carson and Taekeun Lee. Together, they have contributed to the development of advanced packaging techniques and technologies that enhance semiconductor performance and reliability.
Conclusion: Marcos Karnezos stands out as an influential inventor in the semiconductor industry, with a strong commitment to pushing the boundaries of technology. His patented innovations reflect a blend of creativity and technical expertise, making significant impacts on the advancements in electronic packaging solutions. With 59 patents to his name, he continues to inspire future generations of inventors in the field.
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