Enter inventor name

Marcos Karnezos

This inventor holds 59 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Chippac, Inc., Stats Chippac Pte. Ltd., Hewlett-Packard Company. Active years: 1986-2015.

USPTO Granted Patents = 59 (Patent Applications = 1)

% Patents Active = 91.5

Average Co-Inventor Count = 1.3

ph-index = 28

Forward Citations = 2,106(Granted Patents)

Forward Citations (Not Self Cited) = 1,716(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

Stats Chippac Pte. Ltd.

patents

2 out of 9,639

Hewlett-Packard Company

patents

4. 1 out of 777

Varian Associates, Inc.

patents

Years Active: 1986-2015

Loading Chart...

Areas of Expertise:

Multi-Package Module

Wire Bond Interconnect

Chip Scale Package

Ball Grid Array

Land Grid Array

Thermal Management

Integrated Circuit

Stacked Packages

Adhesive Structure

Inverted Package

Tape Substrate

59 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8994162 - Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package (2015-03-31),

2. 8970049 - Multiple chip package module having inverted package stacked over die (2015-03-03),

3. 8552551 - Adhesive/spacer island structure for stacking over wire bonded die (2013-10-08),

4. 8410596 - Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package (2013-04-02),

5. 8143100 - Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages (2012-03-27),

6. 8030756 - Plastic ball grid array package with integral heatsink (2011-10-04),

7. 8030134 - Stacked semiconductor package having adhesive/spacer structure and insulation (2011-10-04),

8. 7935572 - Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages (2011-05-03),

9. 7923822 - Integrated circuit package system including shield (2011-04-12),

10. 7829382 - Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package (2010-11-09),

11. 7749807 - Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies (2010-07-06),

12. 7736950 - Flip chip interconnection (2010-06-15),

13. 7732254 - Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages (2010-06-08),

14. 7728417 - Integrated circuit package system including shield (2010-06-01),

15. 7692279 - Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package (2010-04-06),

Title: The Innovative Journey of Marcos Karnezos

Introduction: Marcos Karnezos, based in Palo Alto, CA, is a prolific inventor known for his significant contributions to the semiconductor industry. With an impressive portfolio of 59 patents, he has played a vital role in advancing technology through innovative solutions.

Latest Patents: Among his latest patents, Marcos has developed groundbreaking semiconductor multi-package modules. One notable invention includes a semiconductor multi-package module featuring a tape substrate land grid array package stacked over a ball grid array package. This design employs a single metal layer tape substrate, which integrates a patterned metal layer affixed to a patterned dielectric layer. Such configurations are essential for effective interconnection between die and other module components. Another significant patent entails a multi-chip package module that includes an inverted package stacked over a die, incorporating design innovations that prevent damage during the stacking process.

Career Highlights: Throughout his career, Marcos Karnezos has worked with influential companies, including Chippac, Inc. and Stats Chippac Pte. Ltd. His diverse experiences in these organizations have refined his expertise and propelled his innovative spirit in the realm of semiconductor technology.

Collaborations: Marcos has collaborated with notable professionals, including Flynn P. Carson and Taekeun Lee. Together, they have contributed to the development of advanced packaging techniques and technologies that enhance semiconductor performance and reliability.

Conclusion: Marcos Karnezos stands out as an influential inventor in the semiconductor industry, with a strong commitment to pushing the boundaries of technology. His patented innovations reflect a blend of creativity and technical expertise, making significant impacts on the advancements in electronic packaging solutions. With 59 patents to his name, he continues to inspire future generations of inventors in the field.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]