The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
May. 28, 2010
Hyeog Chan Kwon, Seoul, KR;
Hyun Joung Kim, Ichon-si, KR;
Jae Chang Kim, Changwon, KR;
Taeg Ki Lim, Icheon, KR;
Jong Wook Ju, Ichon-si, KR;
Hyeog Chan Kwon, Seoul, KR;
Hyun Joung Kim, Ichon-si, KR;
Jae Chang Kim, Changwon, KR;
Taeg Ki Lim, Icheon, KR;
Jong Wook Ju, Ichon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.