Jae Chang Kim

Title: **Jae Chang Kim: Innovator in Integrated Circuit Package Systems**

Introduction:

Jae Chang Kim is a renowned inventor based in Changwon, South Korea, specializing in advancements within the realm of integrated circuit packaging. With a total of three patents under his name, Kim has made significant contributions to the technology industry, particularly in enhancing the reliability and efficiency of circuit packaging systems.

Latest Patents:

Jae Chang Kim has developed several innovative patents, including:

1. **Integrated Circuit Package System Including Honeycomb Molding**: This patent outlines a method for manufacturing an integrated circuit package system that involves providing a substrate with a top surface, configuring that surface to include electrical contacts, attaching an integrated circuit, and depositing a specialized material to prevent warpage. The material is designed with discrete hollow conduits that are over and larger than the electrical contacts.

2. **Integrated Circuit Package System with Internal Stacking Module Adhesive**: Another significant invention by Kim involves creating an integrated circuit package system where a substrate serves as the base for a two-part package. This includes a base assembled package and a top package, with the application of a top package stacking material for insulation between the two.

Career Highlights:

Professionally, Jae Chang Kim is associated with Stats Chippac Pte. Ltd., a leading company in semiconductor packaging and test services. Throughout his career, Kim has remained at the forefront of innovations in integrated circuit technology, driving advancements that enhance product performance and reliability.

Collaborations:

In his pursuit of technological advancements, Kim collaborates with talented colleagues, including Hyeog Chan Kwon and Hyun Joung Kim. Their combined expertise fosters a dynamic environment conducive to innovation and the development of groundbreaking technologies.

Conclusion:

Jae Chang Kim's contributions to integrated circuit packaging underscore his role as a pivotal inventor in the electronics field. His latest patents reflect a keen understanding of both the technical challenges and the innovative solutions necessary to push the boundaries of circuit technology. As the industry evolves, Kim's work remains an essential part of the ongoing discourse surrounding advancements in electronics manufacturing.